In the field of electronics and electronics, with the rapid development of integration and assembly technology, the volume of electronic components and logic circuits has been reduced by thousands of times. There is an urgent need for high heat dissipation packaging insulation plastics. Therefore, traditional thermal conductive materials are limited and cannot meet the needs of industrial and technological development. Thermal conductive plastics are increasingly valued due to their excellent comprehensive performance, and their application fields are constantly expanding. The development prospects of thermal conductive plastics are quite optimistic. The filling materials and molding process have a significant impact on the thermal conductivity of plastics, so improving the thermal conductivity of thermal conductive plastics can be achieved from the following aspects:
1、 Develop new thermal conductive fillers.
2、 Modify the surface of the filler particles. From a definition perspective, particle size in composite polymer materials can be considered as not affecting thermal conductivity. In fact, when the particle size is several micrometers or more, the thermal conductivity is not affected by the particle diameter. However, in the field of powder, when the particle diameter is below a few micrometers, the thermal conductivity increases as the particle diameter decreases. PVC profiles are prone to secondary condensation due to changes in particle dispersion state, resulting in the formation of a particle continuum and an increase in thermal conductivity. In other words, this effect affects thermal conductivity due to different dispersion states. For example, the particle size of dispersed particle Al2O3 is 1 μ When m is below, the thermal conductivity will increase.

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